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What is the difference between horizontal and vertical equity? How do tax preferences affect people’s view of horizontal equity?
A 250 mm diameter silicon wafer has a processable area that is circular with a diameter = 225 mm.
\r\nThe IC chips that will be fabricated on the wafer surface are square with 20 mm on a side.
\r\nHowever, the processable area on each chip is only 18 mm by 18 mm. The density of circuits
\r\nwithin each chip’s processable area is 465 circuits per mm2. (a) How many IC chips can be placed
\r\nonto the wafer? (b) Using Rent’s Rule with C = 3.8 and m = 0.43, how many input/output terminals
\r\n(pins) will be needed for each chip package?
Solve Problem 34.5, only use a wafer size of 12.0 in whose processable area has a diameter = 11.75
\r\nin. What is the percent increase in (a) processable area on the wafer and (b) number of chips on the
\r\nwafer compared to the 200% increase in wafer diameter?
A 6.0-in wafer has a processable area with a 5.85-in diameter. How many square IC chips can be
\r\nfabricated within this area, if each chip is 0.50 in on a side? Assume the cut lines (streets) between
\r\nchips are of negligible width.
Solve Problem 34.3, only use a wafer size of 257 mm whose processable area has a diameter = 250
\r\nmm. What is the percent increase in (a) wafer diameter, (b) processable wafer area, and (c) number of
\r\nchips, compared to the values in the previous problem?
\r\n
The processable area on a 156-mm-diameter wafer is a 150-mm-diameter circle. How many square
\r\nIC chips can be processed within this area, if each chip is 7.5 mm on a side? Assume the cut lines
\r\n(streets) between chips are of negligible width.
A silicon boule is grown by the Czochralski process to a diameter of 5.25 in and a length of 5 ft. The
\r\nseed and tang ends are cut off, reducing the effective length to 48.00 in. Assume that the seed and
\r\ntang portions are conical in shape. The diameter is ground to 4.921 in (125 mm). A primary flat of
\r\nwidth 1.625 in is ground on the surface the entire length of the ingot. The ingot is then sliced into
\r\nwafers 0.025 in thick, using an abrasive saw blade whose thickness = 0.0128 in. Determine (a) the
\r\noriginal volume of the boule, in3; (b) how many wafers are cut from it, assuming the entire 4 ft length
\r\ncan be sliced, and (c) what is the volumetric proportion of silicon in the starting boule that is wasted
\r\nduring processing?
A single crystal boule of silicon is grown by the Czochralski process to an average diameter of 320
\r\nmm with length = 1500 mm. The seed and tang ends are removed, which reduces the length to 1150
\r\nmm. The diameter is ground to 300 mm. A 90-mm-wide flat is ground on the surface which extends
\r\nfrom one end to the other. The ingot is then sliced into wafers of thickness = 0.50 mm, using an
\r\nabrasive saw blade whose thickness = 0.33 mm. Assuming that the seed and tang portions cut off
\r\nthe ends of the starting boule were conical in shape, determine (a) the original volume of the boule,
\r\nmm3; (b) how many wafers are cut from it, assuming the entire 1150 mm length can be sliced; and
\r\n(c) the volumetric proportion of silicon in the starting boule that is wasted during processing.
There are 16 correct answers in the following multiple choice questions (some questions have multiple
\r\nanswers that are correct). To attain a perfect score on the quiz, all correct answers must be given. Each
\r\ncorrect answer is worth 1 point. Each omitted answer or wrong answer reduces the score by 1 point, and
\r\neach additional answer beyond the correct number of answers reduces the score by 1 point. Percentage
\r\non the quiz is based on the total number of correct answers.
\r\n34.1 How many electronic devices would be contained in an IC chip in order for it to be classified in the
\r\nVLSI category: (a) 1000, (b) 10,000, (c) 1 million, or (d) 100 million?
\r\n34.2 An alternative name for chip in semiconductor processing is which one of the following (one best
\r\nanswer): (a) component, (b) device, (c) die, (d) package, or (e) wafer?
\r\n34.3 Which one of the following is the source of silicon for semiconductor processing: (a) pure Si in
\r\nnature, (b) SiC, (c) Si3N4, or (d) SiO2?
\r\n34.4 Which one of the following is the most common form of radiation used in photolithography: (a)
\r\nelectronic beam radiation, (b) incandescent light, (c) infrared light, (d) ultraviolet light, or (e)
\r\nX-ray?
\r\n34.5 After exposure to light, a positive resist becomes (a) less soluble or (b) more soluble to the chemical
\r\ndeveloping fluid?
\r\n34.6 Which of the following processes are used to add layers of various materials in IC fabrication (three
\r\nbest answers): (a) chemical vapor deposition, (b) diffusion, (c) ion implantation, (d) physical vapor
\r\ndeposition, (e) plasma etching, (f) thermal oxidation, and (g) wet etching?
\r\n34.7 Which of the following are doping processes in IC fabrication (two best answers): (a) chemical
\r\nvapor deposition, (b) diffusion, (c) ion implantation, (d) physical vapor deposition, (e) plasma
\r\netching, (f) thermal oxidation, and (g) wet etching?
\r\n34.8 Which one of the following is the most common metal for intraconnection of devices in a silicon
\r\nintegrated circuit: (a) aluminum, (b) copper, (c) gold, (d) nickel, (e) silicon, or (f) silver?
\r\n34.9 Which etching process produces the more anisotropic etch in IC fabrication: (a) plasma etching or
\r\n(b) wet chemical etching?
\r\n34.10 Which of the following are the two principal packaging materials used in IC packaging: (a)
\r\naluminum, (b) aluminum oxide, (c) copper, (d) epoxies, and (e) silicon dioxide?
\r\n34.11 Which of the following metals are commonly used for wire bonding of chip pads to the lead frame
\r\n(two best answers): (a) aluminum, (b) copper, (c) gold, (d) nickel, (e) silicon, and (f) silver?
\r\n\r\n
What is the difference between postmolding and premolding in plastic IC chip packaging?
\r\n
What is a DIP?
\r\n
Name the two categories of component mounting to a printed circuit board.
\r\n
What is Rent's rule?
\r\n
What are some of the important design functions of IC packaging?
\r\n
Define epitaxial deposition.
\r\n
What layer material is produced by thermal oxidation in IC fabrication?
\r\n
Name the three exposure techniques in photolithography.
\r\n
Why is ultraviolet light favored over visible light in photolithography?
\r\n
What is a photoresist?
\r\n
What are the alternatives to photolithography in IC processing?
\r\n
What is the name of the process most commonly used to grow single crystal ingots of silicon for
\r\nsemiconductor processing?
\r\n
What are some of the significant sources of contaminants in IC processing?
\r\n
What is a clean room and explain the classification system by which clean rooms are rated?
\r\n
What are the three major stages in the production of silicon-based integrated circuits?
\r\n
Describe the planar process.
\r\n
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