A silicon wafer with a diameter of 200 mm is processed over a circular area whose diameter = 190\nmm. The chips to be fabricated are square with 10 mm
A silicon wafer with a diameter of 200 mm is processed over a circular area whose diameter = 190
\r\nmm. The chips to be fabricated are square with 10 mm on a side. The density of point defects in the
\r\nsurface area is 0.0047 defects/cm2. Determine an estimate of the number of good chips using the
\r\nBose-Einstein yield computation.