A silicon boule is grown by the Czochralski process to a diameter of 5.25 in and a length of 5 ft. The\nseed and tang ends are cut off, reducing the ef
A silicon boule is grown by the Czochralski process to a diameter of 5.25 in and a length of 5 ft. The
\r\nseed and tang ends are cut off, reducing the effective length to 48.00 in. Assume that the seed and
\r\ntang portions are conical in shape. The diameter is ground to 4.921 in (125 mm). A primary flat of
\r\nwidth 1.625 in is ground on the surface the entire length of the ingot. The ingot is then sliced into
\r\nwafers 0.025 in thick, using an abrasive saw blade whose thickness = 0.0128 in. Determine (a) the
\r\noriginal volume of the boule, in3; (b) how many wafers are cut from it, assuming the entire 4 ft length
\r\ncan be sliced, and (c) what is the volumetric proportion of silicon in the starting boule that is wasted
\r\nduring processing?