Problem NO: 2

A silicon boule is grown by the Czochralski process to a diameter of 5.25 in and a length of 5 ft. The\nseed and tang ends are cut off, reducing the ef

A silicon boule is grown by the Czochralski process to a diameter of 5.25 in and a length of 5 ft. The

\r\n

seed and tang ends are cut off, reducing the effective length to 48.00 in. Assume that the seed and

\r\n

tang portions are conical in shape. The diameter is ground to 4.921 in (125 mm). A primary flat of

\r\n

width 1.625 in is ground on the surface the entire length of the ingot. The ingot is then sliced into

\r\n

wafers 0.025 in thick, using an abrasive saw blade whose thickness = 0.0128 in. Determine (a) the

\r\n

original volume of the boule, in3; (b) how many wafers are cut from it, assuming the entire 4 ft length

\r\n

can be sliced, and (c) what is the volumetric proportion of silicon in the starting boule that is wasted

\r\n

during processing?

0  reviews

Suggestions based on the Question and Answer that you are currently viewing

The benefits of buying with AnswerDone:

Guaranteed quality through customer reviews

Access to High-Quality Documents

Our platform features a wide range of meticulously curated documents, from solved assignments and research papers to detailed study guides. Each document is reviewed to ensure it meets our high standards, giving you access to reliable and high-quality resources.

Quick and easy check-out

Easy and Secure Transactions

We prioritize your security. Our platform uses advanced encryption technology to protect your personal and financial information. Buying with AnswerDone means you can make transactions with confidence, knowing that your data is secure

Focus on what matters

Instant Access

Once you make a purchase, you’ll have immediate access to your documents. No waiting periods or delays—just instant delivery of the resources you need to succeed.

$1.49  0x  sold
    (0)
  Add to cart