Problem NO: 9

A silicon boule has been processed through grinding to provide a cylinder whose diameter = 285\nmm and whose length = 900 mm. Next, it will be sliced i

A silicon boule has been processed through grinding to provide a cylinder whose diameter = 285

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mm and whose length = 900 mm. Next, it will be sliced into wafers 0.7 mm thick using a cut-off

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saw with a kerf = 0.5 mm. The wafers thus produced will be used to fabricate as many IC chips as

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possible for the personal computer market. Each IC has a market value to the company of $98. Each

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chip is square with 15 mm on a side. The processable area of each wafer is defined by a diameter =

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270 mm. Estimate the value of all of the IC chips that could be produced, assuming an overall yield

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of 80% good product.

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