A silicon boule has been processed through grinding to provide a cylinder whose diameter = 285\nmm and whose length = 900 mm. Next, it will be sliced i
A silicon boule has been processed through grinding to provide a cylinder whose diameter = 285
\r\nmm and whose length = 900 mm. Next, it will be sliced into wafers 0.7 mm thick using a cut-off
\r\nsaw with a kerf = 0.5 mm. The wafers thus produced will be used to fabricate as many IC chips as
\r\npossible for the personal computer market. Each IC has a market value to the company of $98. Each
\r\nchip is square with 15 mm on a side. The processable area of each wafer is defined by a diameter =
\r\n270 mm. Estimate the value of all of the IC chips that could be produced, assuming an overall yield
\r\nof 80% good product.
\r\n