A 250 mm diameter silicon wafer has a processable area that is circular with a diameter = 225 mm.\nThe IC chips that will be fabricated on the wafer su
A 250 mm diameter silicon wafer has a processable area that is circular with a diameter = 225 mm.
\r\nThe IC chips that will be fabricated on the wafer surface are square with 20 mm on a side.
\r\nHowever, the processable area on each chip is only 18 mm by 18 mm. The density of circuits
\r\nwithin each chip’s processable area is 465 circuits per mm2. (a) How many IC chips can be placed
\r\nonto the wafer? (b) Using Rent’s Rule with C = 3.8 and m = 0.43, how many input/output terminals
\r\n(pins) will be needed for each chip package?