Problem NO: 7

A 250 mm diameter silicon wafer has a processable area that is circular with a diameter = 225 mm.\nThe IC chips that will be fabricated on the wafer su

A 250 mm diameter silicon wafer has a processable area that is circular with a diameter = 225 mm.

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The IC chips that will be fabricated on the wafer surface are square with 20 mm on a side.

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However, the processable area on each chip is only 18 mm by 18 mm. The density of circuits

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within each chip’s processable area is 465 circuits per mm2. (a) How many IC chips can be placed

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onto the wafer? (b) Using Rent’s Rule with C = 3.8 and m = 0.43, how many input/output terminals

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(pins) will be needed for each chip package?

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