Problem NO: 8

A 12-inch diameter silicon wafer has a processable area that is circular with a diameter = 11.4 in.\nThe IC chips that will be fabricated on the wafer

A 12-inch diameter silicon wafer has a processable area that is circular with a diameter = 11.4 in.

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The IC chips that will be fabricated on the wafer surface are square with 0.75 in on a side,

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including an allowance for subsequent chip separation. However, the processable area on each chip

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is only 0.60 in by 0.60 in. The density of circuits within each chip’s processable area is 100,000

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circuits per square inch. (a) How many IC chips can be placed onto the wafer? (b) Using Rent’s

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Rule with C = 3.8 and m = 0.43, how many input/output terminals (pins) will be needed for each

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chip package?

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