A 12-inch diameter silicon wafer has a processable area that is circular with a diameter = 11.4 in.\nThe IC chips that will be fabricated on the wafer
A 12-inch diameter silicon wafer has a processable area that is circular with a diameter = 11.4 in.
\r\nThe IC chips that will be fabricated on the wafer surface are square with 0.75 in on a side,
\r\nincluding an allowance for subsequent chip separation. However, the processable area on each chip
\r\nis only 0.60 in by 0.60 in. The density of circuits within each chip’s processable area is 100,000
\r\ncircuits per square inch. (a) How many IC chips can be placed onto the wafer? (b) Using Rent’s
\r\nRule with C = 3.8 and m = 0.43, how many input/output terminals (pins) will be needed for each
\r\nchip package?